Casing for the photoelectric conductive element

ABSTRACT

The purpose of the present invention is to make the thickness of the photoconductive semiconductor element body as flat and thin as possible so that it may easily be built into a camera or other instruments, and also to increase the resistance against vibration and shock. This photoconductive semiconductor element body of the present invention consists of a base frame onto which is attached fixedly an insulating thin plate with the photoelectric conductive layer on top and two cuts in its edge, and a window frame, with a transparent window, whose periphery comes on top of the base frame, and the lead material that makes contact with the photoelectric conductive layer at the said cuts and is closed and made airtight inside the base frame by a hard glass.

United States Patent Aug. 1, 1968, Japan, No. 43/65465 CASING FOR THE PHOTOELECTRIC CONDUCTIVE ELEMENT 5 Claims, 6 Drawing Figs.

US. Cl .;l 338/19, 136/89, 338/15 Int. Cl l-l0lc 7/08 Field ofSearch 338/19, 15,

References Cited Primary Examiner-Rodney D. Bennett, Jr. Assistant Examiner-Richard E. Berger Attorney-Watson, Cole, Grindle & Watson ABSTRACT: The purpose of the present invention is to make the thickness of the photoconductive semiconductor element body as flat and thin as possible so that it may easily be built into a camera or other instruments, and also to increase the resistance against vibration and shock. This photoconductive semiconductor element body of the present invention consists of a base frame onto which is attached fixedly an insulating thin plate with the photoelectric conductive layer on top and two cuts in its edge, and a window frame, with a transparent window, whose periphery comes on top of the base frame, and the lead material that makes contact with the photoelectric conductive layer at the said cuts and is closed and made airtight inside the base frame by a hard glass.

PATENTEUJAN 4x972 SHEET 1 [IF 2 F 6. (PE/O/Z/J/ZT) INVENT OR QRNEY \IOZ lOl [IO SHEET 2 0F 2 PATENTED JAN 41972 INVENTOR ATTORNEY CASING FOR THE PHOTOELECTRIC CONDUCTIV E ELEMENT BACKGROUND OF THE INVENTION In the conventional casing, two holes are cut in the insulating thin plate on top of which is the vaporated photoelectric conductive layer, and two lead wires with bend ends are put through these two holes respectively, and these bent ends are bound onto the photoelectric conductive layer by some conductive bond. The lead wires, which are closed inside airtightly by glass through the insertion holes in the base plate, hold up the photoelectric conductive element which is covered by a window frame which is soldered or welded onto the baseplate. As is evident from above, this conventional casing has the defect of having to be made very thick because the base plate has to be made thick to maintain the constructional strength and to hold tightly the lead wires which hold up the photoelectric conductive element in midair, and also to prevent any leak where the lead wires go through the insertion holes in the frame plate. This conventional casing also has the defect that the lead wires holding up the photoelectric conductive element are easily vibrated by shock and other forces from outside and because of this the electric contact between the bent ends of the lead wires and the photoelectric conductive layer is often made defective, and some instances have been known in which some cracks were made where the bent ends are fixed at the holes in the insulating thin plate and the wires broke off the thin plate.

SUMMARY OF THE INVENTION The photoconductive semiconductor element body of the present invention is rid of these'known defects of the conventional casing and the purpose of the present invention is first to increase the resistance of the photoelectric conductive element against vibration and shock, and secondly to make the thickness of the entire casing flat and thin so that it can easily be built into a camera or other instruments, and thirdly to facilitate the manufacturing process of inserting the photoelectric conductive element into the casing.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows the vertical side section of a conventional casing for the photoelectric conductive element;

FIG. 2 the vertical side section of a preferred embodiment of the present invention;

FIG. 3 the partial perspective view of the said preferred embodiment without the window frame to show the inside;

FIG. 4 the vertical side section of another preferred embodiment of the present invention;

FIG. 5 the perspective view of the said preferred embodiment without the window frame to show the inside; and

FIG. 6 shows the vertical side section or a variation of the preferred embodiment shown by FIG. 4.

DESCRIPTION OF THE PREFERRED EMBODIMENT To explain the construction of the present invention according to the first preferred embodiment shown in FIGS. 2 and 3: the conventional casing shown in FIG. 1 has the alumina ceramic thin plate 29 on top of which is the evaporated photoelectric conductive layer 30 onto which is bound by conductive bond 35, 35' the bent ends 34, 34 of the lead wires 33, 33 which are closed airtightly by glass inside the baseplate 21 and support the alumina plate 29; whereas in the present invention, the alumina ceramic thin plate 9 on top of which is the evaporated photoelectric conductive layer 10 is attached fixedly by bond 11 onto a fixed place on the baseplate 1. In both edges of the alumina ceramic thin plate 9 are the cuts 12, 12' into which are fixed the bent ends 14, 14 of the lead pieces l3, l3 and these bent ends l4, 14 are bound by conductive bond 15, 15 onto the evaporated photoelectric conductive layer 10. The lead pieces 13, 13 are extended outwardly approximately in parallel with the baseplate 1 sothat they may not contact the baseplate 1 and come outside between the base plate 1 and the upper frame 2 whose periphery approximately coincides withthat of the baseplate 1. The hard glass layer 3, 4 helps close in the lead pieces 13, 13 airtightly. When the photoelectric conductive element 9, 10 and the lead pieces 13, 13' are fixed into the base frame which consists of the baseplate 1, hard glass 3, 4, and the upper frame 2, a hard glass plate (notshown in the figures) may be welded, as occasion demands, between the lead pieces 13, 13' and the baseplate l to secure the insulation between the two and also to stabilize the lead pieces 13,13.

Onto the upper frame 2 of the base frame is soldered or welded by percussion welding the flange 7 of the window frame 6 with the window consisting of the transparent substance 8.

In the construction described above, iron, nickehcobalt, or an alloy of these metals is to be used as the material for the base plate 1, upper frame 2, window frame 6, and lead pieces 13, 13' and some other insulating thin plate can be used in place of the alumina ceramic thin plate.

In another preferred embodiment shown in FIGS. 4 and 5, the flat tray-shaped base frame 101 has the flange 102 around it and in one side of it are the insertion holes 103, 103 for the lead wires 113, 113'. On the bottom of this tray-shaped base frame 101 is fixedly attached by bond 11! the'photoelectric conductive element consisting of the insulating thin plate 109 with two slanting cuts 112, 112 in one side and the photoelectric conductive layer on top. The lead wires 113, 113 are airtightly closed in by hard glass layer 104, 104 where they are inserted through the said-insertion holes 103, '103, and the ends of these wires 113, 113' are bent along and fixedly attached to the slant of the slanting cuts 112, 1 12 of the said insulating thin plate 109Jll7'shows a pressing piece that presses down the hard glass layer 104, 104.

The window frame 106 is approximately of the same construction as that of the first preferred embodiment. It has the window consisting of the transparent substance 108 and its flange 107 is approximately of the same shape as the flange 102 of the tray-shaped base frame 101, and the two flanges are either soldered or welded. The ridge -116.on the flange 102 fixes into the groove in the flange 107 and they facilitate the regulation of the mutual position of the window frame 106 and the tray-shaped base frame 101 in the construction process and also prevent leak after soldering or welding.

FIG. 6 shows a variation of the preferred embodiment (FIGS. 4 and 5) described above, in which the lead wires 113, 113 are inserted from both sides. The slanting cuts 112 are eachcut in either side of the insulating thin plate l09and the pressing pieces 117 are also set on both sides. Otherwise the construction is approximately the same as the one shown in FIGS. 4 and 5.

In any of the preferred embodiments described above of the present invention, the photoelectric conductive element which is firmly attached onto the base frame has more resistance against vibration and shock, and the thickness of the entire casing can be made flat and thin, and also the building in and manufacturing processes are facilitated.

We claim:

1. A photoconductive semiconductor element body comprising a base plate, an element of insulating material mounted on said baseplate said element having a flat upper surface and an edge surface which slopes downwardly and outwardly from said flat upper surface, a layer of photoconductive semiconductive material covering the flat upper surface of said element, a lead supporting band comprising hard glass mounted upon said baseplate said band encircling said element and in spaced relation thereto, two lead wires passing through, and making airtight contact with, the hard glass of said band, the inner ends of said lead wires engaging sloping surfaces of said element, being spaced from the baseplate, and being electrically connected to said layer of photoconductive semiconductive material, and a cover having airtight contact with said band, said cover having a transparent portion permitting inspection of said layer of photoconductive semiconductive material from without.

2. The photoconductive semiconductor element body set forth in claim 1 in which said element is rectangular and the encircling band is rectangular and in spaced relation to the edge of said element throughout its length.

3. The photoconductive semiconductor element body described in claim 1 in which said lead supporting band comprises a layer of hard glass mounted on said base plate and a narrow elongated plate is mounted upon, and adheres to, the hard glass portion of said band, the cover making airtight contact therewith.

4. A photoconductive semiconductor element body comprising a shallow open dishlike receptacle and a cover for closing and rendering the same airtight, said housing comprising a base plate, sidewall and a continuous flange extending outwardly from that edge of the sidewall remote from the baseplate the sidewall being apertured for the passage of leads therethrough, a flat element formed of insulating material positioned within said receptacle and attached to said base plate with its edge spaced from the receptacle sidewall at all points around its periphery, portions of said edge being downwardly and outwardly sloped, a photoconductive semiconductor layer positioned upon the otherwise free face of said element, leads extending through the openings in the sidewall of the receptacle and electrically connected to said photoconductive semiconductor layer at the sloping edge of said element, said leads being spaced from said base plate, bodies of hard glass encircling the leads at said openings and engaging adjacent portions of said receptacle to seal said openings against the passage of air therethrough, and a cover having continuous airtight engagement with the flange of the receptacle, said cover having a transparent portion, for the purpose set forth.

'5. The photoconductive semiconductor element set forth in claim 4 in which the sidewall has apertures formed therein on opposite sides thereof, the leads extending in opposite directions from the flat element of insulating material with its photoconductive semiconductor positioned thereon. 

1. A photoconductive semiconductor element body comprising a base plate, an element of insulating material mounted on said baseplate, said element having a flat upper surface and an edge surface which slopes downwardly and outwardly from said flat upper surface, a layer of photoconductive semiconductive material covering the flat upper surface of said element, a lead supporting band comprising hard glass mounted upon said baseplate, said band encircling said element and in spaced relation thereto, two lead wires passing through, and making airtight contact with, the hard glass of said band, the inner ends of said lead wires engaging sloping surfaces of said element, being spaced from the baseplate, and being electrically connected to said layer of photoconductive semiconductive material, and a cover having airtight contact with said band, said cover having a transparent portion permitting inspection of said layer of photoconductive semiconductive material from without.
 2. The photoconductive semiconductor element body set forth in claim 1 in which said element is rectangular and the encircling band is rectangular and in spaced relation to the edge of said element throughout its length.
 3. The photoconductive semiconductor element body described in claim 1 in which said lead supporting band comprises a layer of hard glass mounted on said base plate and a narrow elongated plate is mounted upon, and adheres to, the hard glass portion of said band, the cover making airtight contact therewith.
 4. A photoconductive semiconductor element body comprising a shallow open dishlike receptacle and a cover for closing and rendering the same airtight, said housing comprising a base plate, sidewall and a continuous flange extending outwardly from that edge of the sidewall remote from the baseplate, the sidewall being apertured for the passage of leads therethrough, a flat element formed of insulating material positioned within said receptacle and attached to said base plate with its edge spaced from the receptacle sidewall at all points around its periphery, portions of said edge being downwardly and outwardly sloped, a photoconductive semiconductor layer positioned upon the otherwise free face of said element, leads extending through the openings in the sidewall of the receptacle and electrically connected to said photoconductive semiconductor layer at the sloping edge of said element, said leads being spaced from said base plate, bodies of hard glass encircling the leads at said openings and engaging adjacent portions of said receptacle to seal said openings against the passage of air therethrough, and a cover having continuous airtight engagement with the flange of the receptacle, said cover having a transparent portion, for the purpose set forth.
 5. The photoconductive semiconductor element set forth in claim 4 in which the sidewall has apertures formed therein on opposite sides thereof, the leads extending in opposite directions from the flat element of insulating material with its photoconductive semiconductor positioned thereon. 